Insulating layer isolation: PCB usually consists of multiple stacked circuit layers with insulating layer isolation between these layers. The insulation layer is made of insulating material, usually fiberglass-reinforced epoxy (FR-4) or polytetrafluoroethylene (PTFE), etc. These insulating layers create physical isolation between different circuit layers, preventing electrical interconnection between circuits.
Circuit trace design: PCB design should consider the layout of circuit traces. Circuit traces are the wires that connect electronic components and must be laid out correctly according to design rules. Circuit traces should be grouped according to the required electrical isolation to ensure there are no interconnections across different circuit layers.
Insulation distance: PCB design usually specifies the insulation distance that must be maintained between different circuits. This refers to the minimum distance that must be maintained on the insulating material to prevent electrical breakdown. The size of the insulation distance depends on the voltage level of the circuit. Higher voltages require larger insulation distances.
Insulating properties: It is important to use insulation materials with excellent insulating properties. Insulating materials should have high insulation resistance to ensure that current does not pass through the material, and good insulation voltage resistance to prevent voltage breakdown. Choosing high-quality insulation materials is critical.
Layer planning: For multi-layer PCBs, the hierarchical distribution of circuits must be carefully planned during design. Low-frequency and high-frequency circuits should be placed on different layers to avoid interference. Generally, high frequency circuits are more susceptible to interference and therefore require more careful planning and insulation.
Differential signaling and shielding: For circuits that require a high degree of isolation, differential signaling and shielding techniques can be used. Differential signaling transmits data through two signal lines of opposite polarity, which can effectively reduce interference. Shielding material can be added on the circuit layer to isolate high frequency signals.
In short, the correct selection of insulation materials, reasonable layout of circuit traces, planning of insulation distances, and the use of differential signal transmission and shielding technology are all key factors to ensure that different circuits do not interfere with each other. These design and material selection decisions help create reliable, isolated electronic circuits.
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